Industrial Scanner
QC430
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QC430


Non-Contact High-Precision Scanning
Delivers accurate scanning from a high working distance-ideal for non-flat or delicate objects.

Modular & Flexible Integration
Modular design allows easy integration with various equipment and conveyor systems, offering greater flexibility ininstallation and maintenance.

High-Speed USB 3.1 Transmission
USB 3.1 interface enhances image capture speed and ensures high productivity.

Adjustable Exposure for Optimized Imaging
Exposure time can be fine-tuned based on object characteristics to ensure the best image quality.

High-Precision & StableTransmission
Precision transmission system ensures stable scanning, minimizes errors, and improves inspection accuracy.

Dedicated SDK for Easy Integration
Comes with a full-featured SDK for seamless system integration and easy secondary development.

規格
| Item | Details |
| Product Name | Linear Scan Module |
| Image Sensor Type | Color Linear CCD |
| Resolution | 21.2μm / 1200dpi |
| Light Source | LED |
| Scanning Area | 304.8mm X 419.1mm(12”x16.5”) |
| Scanning Speed | 79.4s / 1200dpi |
| Connectivity | USB 3.1 |
| Working Distance | 30mm |
| Memory | 8GB |
| Output Format | TIFF / JPG |
| Dimensions (L x W x H) | 702mm (L) X 406mm (W) X 132mm (H) |
| Weight | 11kg |
| Power Supply | DC 24V,2.5A |
| Power Consumption | 60W |
| Operating Temperature | 5°C ~ 40°C |
*Product specifications described herein are subject to change without notice.
功能清單
High-Resolution Color Linear CCD:Equipped with a high-performance color line-scan CCD sensor, providing exceptionally sharp, continuous image capture and high-integrity data streams required for automated inspections.
Turnkey AOI Optical Integration:Functions as a complete, pre-configured image acquisition optical module tailored for Automated Optical Inspection (AOI) setups, combining premium sensors and specialized mechanics to eliminate complex integration friction.
Instantaneous Real-Time Processing:Engineered for high-speed industrial production lines to capture and transmit real-time image data immediately, ensuring instantaneous defect detection without creating pipeline bottlenecks.
Superior Color and Grayscale Fidelity:Built to precisely differentiate micro-level color variations, structural flaws, and fine gray gradations, guaranteeing high-accuracy sorting and anomaly matching.
Industrial-Grade Reliability:Features a ruggedized structural housing designed to withstand harsh manufacturing conditions, maintaining precise optical alignments despite continuous equipment vibrations and temperature fluctuations.
應用程序/用例
Printed Circuit Board (PWBA/PCB) Inspections:Widely deployed inside advanced PWBA inspection systems to identify surface anomalies, solder defects, missing chips, and trace misalignments on assembled circuit boards.
Industrial Semiconductor & IC Flaw Screening:Ideal for integrated circuit (IC) packaging lines and wafer inspection modules to detect surface cracks, chip contamination, and automated part-position benchmarking.
High-Speed Textile & Fabric Defect Detection:Utilized in automated textile web systems to spot fabric stains, loose flocks, thread impurities, holes, and pattern printing alignment faults on running cloth lines.
Advanced Material & Continuous Surface Vision:Tailored for automated optical inspection platforms validating sheet goods, metallic rolls, non-woven fabrics, and composite materials in manufacturing lines.







